AMD is looking to accelerate next-generation computing experiences, from AI and data centers to PCs, gaming, and embedded systems. This role aims to contribute to the thermal design and simulation of high-performance hardware, specifically Alveo cards, to optimize cooling strategies and ensure design-for-manufacturability.
Requirements
- Background in Solid Mechanics.
- Proficiency in Ansys Mechanical for finite element analysis (FEA).
- Experience with Creo or similar 3D CAD tools for mechanical design and modeling.
- Strong programming skills, especially in Python, for simulation automation and data processing.
Responsibilities
- We will involve you in the thermal design of Alveo cards, focusing on optimizing cooling strategies for high-performance hardware.
- We will assign you simulation tasks to model and predict assembly process outcomes, helping assess design-for-manufacturability (DFM) status and results.
- Your responsibility will include automating simulations and report generation, streamline workflows and improve efficiency across design and validation steps.
Other
- Currently enrolled in a US based University in a PhD degree program majoring in Mechanical Engineering or related discipline.
- This role requires the student to work full time (40 hours a week), in either a hybrid or onsite work structure throughout the duration of the co-op/intern term
