Supports software development and engineering of new artificial intelligence, machine learning, and deep learning products and technologies for the enterprise through research, leading to new or improved software products for Intel
Requirements
- Deep expertise in the design and optimization of active and passive optoelectronic devices, including modulators, photodetectors, lasers, and semiconductor optical amplifiers (SOAs)
- Strong proficiency with photonic integrated circuit (PIC) design CAD tools
- Extensive tapeout experience with photonics foundries
- Hands-on experience in testing and characterization of integrated optoelectronic components
- Solid understanding of high-speed analog circuitry, including transimpedance amplifiers (TIAs) and modulator drivers
- Knowledgeable in PIC and module packaging for optical communication systems
- Proven experience driving device maturity in foundries and transitioning photonic devices (silicon and III-V) from R_D through New Product Introduction (NPI) to high-volume production for optical engines and/or laser modules
Responsibilities
- Define architectures and designs that meet specifications and performance targets for next-generation optical interconnects
- Develop core integrated circuit components
- Collaborate with cross-functional teams to lead overall project development
- Plan design activities considering performance, schedule, and quality constraints
- Mentor junior designers and layout engineers
- Advise on the development of test plans for post-silicon characterization
- Thoroughly document all design work with review materials and detailed design descriptions
Other
- Ph.D. in Electrical and Computer Engineering, Optics and Optical Engineering, or Physics or related field
- At least 10 years of industry experience in the design and optimization of silicon photonics (SiPh) and/or III-V photonic devices, as well as photonic integrated circuits, with a proven track record of successful product development and/or peer-reviewed publications
- Minimum of 5 years of experience mentoring individual contributors and leading cross-functional teams across design, testing, and packaging disciplines
- Excellent oral and written communication skills
- Must consent to and pass an extended Background Investigation
