KLA is looking to optimize high-performance computing applications, particularly those related to Computational Fluid Dynamics, to enable groundbreaking discoveries and innovations.
Requirements
- Experience with SLURM workload manager and Python for scripting and automation
- Proficiency in programming languages such as Python, C/C++ or Fortran
- Experience with profiling and debugging tools (e.g., Intel VTune, NVIDIA Nsight, or similar)
- Demonstrated ability in HPC optimization and performance analysis with a consistent record of optimizing large-scale scientific simulations
- Deep understanding of parallel programming paradigms (e.g., MPI, OpenMP, CUDA)
- Knowledge of sophisticated computer architectures (e.g., GPUs, FPGAs, hybrid systems)
- Experience with specific CFD software packages (e.g., ANSYS Proficient, OpenFOAM)
Responsibilities
- Analyze and profile HPC applications to identify performance bottlenecks
- Develop and implement optimization strategies, including code parallelization, memory management, and algorithmic improvements
- Work with hardware vendors and software developers to optimize application performance on specific HPC architectures
- Collaborate with research teams to understand their computational needs and translate them into technical requirements
- Stay abreast of the latest advancements in HPC hardware, software, and optimization techniques
Other
- Doctorate (Academic) Degree and 0 years related work experience; Master's Level Degree and related work experience of 3 years; Bachelor's Level Degree and related work experience of 5 years
- Participation in performance incentive programs and eligibility for additional benefits including but not limited to: medical, dental, vision, life, and other voluntary benefits, 401(K) including company matching, employee stock purchase program (ESPP), student debt assistance, tuition reimbursement program, development and career growth opportunities and programs, financial planning benefits, wellness benefits including an employee assistance program (EAP), paid time off and paid company holidays, and family care and bonding leave
