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Intern - HBM System Engineer

Micron Technology

Salary not specified
Oct 8, 2025
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Micron Technology's DRAM and Emerging Memory Group (DEG) is looking to contribute to the validation and optimization of Micron's HBM3E, the fastest and highest-capacity HBM available, to help advance generative AI and high-performance computing.

Requirements

  • Strong understanding of computer architecture, memory systems, and memory technologies.
  • Proficiency in Python, C/C++, and scripting for debugging and testing.
  • Experience validating products with hardware, firmware, and software components.
  • Familiarity with Linux environments.
  • Experience with RTL modeling using Verilog or SystemVerilog.
  • Hands-on experience programming and debugging FPGAs or microcontrollers.
  • Knowledge of memory interfaces and protocols (e.g., LPDDR, DDR, HBM, GDDR, CXL, UCIe, PCIe).

Responsibilities

  • Develop and improve software and hardware to validate HBM in various systems.
  • Configure, maintain, and characterize HBM-based systems in a lab environment.
  • Assist in debugging complex technical challenges across hardware and software.
  • Communicate results and insights to teammates and leadership.
  • Learn and apply knowledge of HBM, DRAM, and memory systems.

Other

  • Enrolled in a Bachelor’s or Master’s program or equivalent experience in Electrical or Computer Engineering.
  • Graduation date must be after September 2026.
  • Excellent problem-solving and analytical skills.
  • Strong communication and teamwork abilities.
  • Ability to clearly convey complex technical concepts in verbal and written form.