Micron Technology is looking to solve the problem of developing innovative memory and storage solutions that accelerate the transformation of information into intelligence, and to enable groundbreaking semiconductor technology development.
Requirements
- Deep understanding of Optical Metrology, Overlay/Registration, Profiling/Topography, X-Ray, electrical, or other metrology techniques.
- Background in data science and demonstrated interest in applying it to semiconductor metrology techniques with large data analytics requirements.
- Have process and equipment related experience or completed coursework in instrumentation and calibration procedures and semiconductor processing.
- Have developed a keen understanding of semiconductor manufacturing processes (diffusion, CVD, Etch, Lithography) and semiconductor process flows (NAND, DRAM).
- Possess strong computer skills, including MS Office and JMP, and programming languages such as MATLAB, Python, C, C++.
- Have experience with Optical films, overlay, electrical, x-ray, profiling, and other physical characterization methods.
- Apply Data Science concepts to large data streams and data analysis challenges.
Responsibilities
- Plan, design, and run experiments in a semiconductor cleanroom using state of the art technology. Analyze top-down and cross-sectional semiconductor structure metrology data using Excel and JMP.
- Work on new metrology technology and measurement techniques to ensure that our measurement capabilities meet the technical device roadmaps.
- Working closely with process development and process integration engineers to optimize measurements for multiple device process flows and layer stacks.
- Develop applications on next generation processes and technologies within Fab 4 and qualification for technology transfers to production fabs.
- Evaluations of new metrology tools to determine lowest cost of ownership solutions with the highest accuracy and precision for deployment in R&D and high-volume manufacturing.
Other
- Must be a current student, must not graduate before September 2026.
- Applicants should be working towards an M.S. or Ph.D. in Engineering, Physics, Material Science, or a semiconductor-related field.
- Six-months co-op and 3 months summer internships will be considered.
- Have the flexibility to work individually, be part of a team, and lead a team at a per project level.
- Use strong communication and organizational skills.
