Micron Technology is looking to solve the problem of accelerating the transformation of information into intelligence by innovating memory and storage solutions. This role specifically focuses on process and device modeling for advanced memory technologies to reduce time and cost in the development cycle.
Requirements
- Process integration and process modules with a DRAM device physics
- Process fabrication and device simulation using advanced TCAD tools
- Performing TCAD studies on semiconductor device characteristics to guide process experiments and device optimizations with scaling
- Executing virtual Design of Experiments (DOE’s) using models to supplement process development
- CMOS and DRAM memory process flow, sub-20nm device physics, mechanical stress
- State of the art models used to design process flows and predict device characteristics through numerical simulations
- Kinetic Monte Carlo (KMC) simulation for advanced process modeling
Responsibilities
- Process and device modeling for company’s advanced memory technologies.
- Perform detailed process and device design using advanced TCAD (Technology Computer-Aided Design) tools and responsible for semiconductor process and device modeling for company’s next-generation memory technologies.
- Work closely with process integration engineers to design experiments based on modeling and existing experimental results, where applicable.
- Interact with a variety of teams including process integration, characterization, and circuit design and product engineers to analyze and debug device and circuit-related issues during process development.
- Utilize computer software and simulation tools to design and analyze semiconductor devices and integrated circuits (ICs) at the process and device level.
- Simulate the behavior of devices and processes before fabrication, thereby reducing time and cost in the development cycle.
- Model various aspects of semiconductor devices, including their electrical, thermal, and optical characteristics, as well as the physical processes involved in their fabrication.
Other
- Employer will accept a Bachelor's degree in Electrical Engineering, Material Science, Materials Engineering, Physics or related field, followed by 10 years of progressive, postbaccalaureate experience in job offered or in a Semiconductor Design Engineer-related occupation.
- State of the art memory technologies for emerging memory, DRAM, vertical DRAM and 3D DRAM cell designs, and Advanced CMOS technologies, including high-K metal gate, FinFET, and nano-wire devices
- Electrical device characterization and design of test structures
- Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future.
- Micron is proud to be an equal opportunity workplace and is an affirmative action employer.
