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Qorvo, Inc. Logo

Module Design Engineering Intern

Qorvo, Inc.

$31 - $42
Oct 17, 2025
Hillsboro, OR, US
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Qorvo is looking to solve complex technical challenges in semiconductor solutions for various high-growth markets by developing innovative power amplifier and transmit modules for wireless communications applications.

Requirements

  • Course work (including lab) in RF circuit design is a must
  • Good knowledge of S-parameters, transmission lines and Smith chart.
  • Other desired course work in Analog circuit design, Electromagnetics, and Solid-state Devices.
  • Experience with simulation tools such as ADS, AWR RF, HFSS/Sonnet/IE3D (EM tool)
  • Experience with RF measurement equipment such as spectrum analyzers and network analyzers is highly beneficial.

Responsibilities

  • Work in a fast-paced team environment focused at developing GaAs HBT power amplifier and transmit modules for wireless communications applications.
  • Work with & supporting Design Engineers to help simulate and/or measure integrated circuit design, laminate design, application circuit design, defining requirements and interfacing with BAW/SAW filter engineers, CMOS, SOI designers and integrating components in module and evaluation of RF modules.
  • Simulation tools such as Agilent ADS, AWR Microwave Office and HFSS will be used for design and to create layout of HBT Power Amplifier using layout tools such as ADS.
  • Work on Test benches including Sig Gen, Spec An, Power Meter, VNA and probe-station to test and evaluate modules.

Other

  • Pursuing BS, MS or PhD in Electrical Engineering or similar
  • Excellent speaking, presentation skills, ability to clearly communicate technical and/or logistic issues and solutions.
  • Be able to enjoy working in fast paced work environment.
  • Competitive hourly pay commensurate with experience: $31/hr - $42/hr (subject to change dependent on physical location)