Consolidating IC packaging database for Image Sensor Group (ISG) products and understanding the evolution and requirements of different IC packaging technologies.
Requirements
- Experience with MS office tools.
- Experience with databases and writing scripts is a plus.
Responsibilities
- Work on consolidating IC packaging database for Image Sensor Group (ISG) products.
- Understand differences in package types and advantages/disadvantages of each one.
- Grasp an understanding of the evolution of package types and designs base on manufacturability, costs, market demands, technology and application advancements.
- Work with Test groups to understand test requirements of products and methodologies including required metrics.
- Work with Rel team to learn IC packaging reliability test conditions, purpose of each test and different type of Rel test requirements base on industry (Automotive, Industrial, Aerospace…etc).
Other
- Collaboration with cross functional teams to familiarize with different IC packaging technologies and product lines ranging from Analog/Mixed Signal devices to Image Sensor products.
- Maintain weekly log of activities and provide weekly reports of learnings/next steps.
- Interest in meeting and working with new people and enjoy multi-tasking as needed.
- Ability to work with cross-functional work groups including suppliers and associates.
- Generate original ideas, encourage new ways of thinking, explore options and develop innovative solutions.
- Continuously seeks new knowledge, fosters a culture of interest, curiosity, and learning. Flexible to change and learn from failures.
- currently enrolled in a degree seeking program preferably in Electrical, Mechanical Engineering, Material Science or Physics degree program.
