Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, their innovative technology is enabling new possibilities. The package engineering team drives semiconductor package development from concept to mass production for all Marvell products.
Requirements
- Basic semiconductor package design skills
- PCB design concepts
- AutoCAD
- computer skills
Responsibilities
- Learn with product-based package projects from concept through development, prototyping, qualification, and volume production release.
- Engage in package substrate design and perform package substrate layout review using APD.
- Understand the basic process of FCBGA assembly and substrate fabrication.
- Apply engineering knowledge of assembly/substrate fabrication to develop new packages and DFX to improve yield and prevent manufacturing, quality, and reliability issues.
Other
- Candidate MUST be currently pursuing a Ph. D or MS in Mechanical, Material, or Chemical Engineering
- Good verbal and written communication skills.
- Semiconductor package related experience is a plus.
- This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law. Marvell may be required to obtain export licensing approval from the U.S. Department of Commerce and/or the U.S. Department of State. Except for U.S. citizens, lawful permanent residents, or protected individuals as defined by 8 U.S.C. 1324b(a)(3), all applicants may be subject to an export license review process prior to employment.
