Texas Instruments is looking to solve customers' problems by delivering advances in miniaturization, integration, high reliability, high performance, and low power through innovative semiconductor packaging technologies.
Requirements
- Semiconductor packaging knowledge is preferred (processes, assembly, reliability, materials, characterization, FA)
Responsibilities
- Interface across various work areas and organizations to help with the design, development, and analysis of different semiconductor packaging technologies to enable differentiation for TI's analog and embedded processing products.
- Assignments may include participation in cross-functional teams to develop internal and external solutions for semiconductor packaging technologies, including Wirebond, Flip Chip, Modules, SIPs and other advanced packages at different stages of readiness.
- Cultivate packaging advancements with work in material, mechanical, thermal, and electrical characterization.
Other
- Currently pursuing an Bachelors degree in Mechanical Engineering, Materials Science, Chemical Engineering, Physics or Electrical Engineering.
- Cumulative 3.0/4.0 GPA or higher
- Demonstrated analytical and problem solving skills
- Strong written and verbal communication skills
- Ability to work in teams and collaborate effectively with people in different functions
- Strong time management skills that enable on-time project delivery
- Ability to build strong, influential relationships
- Ability to work effectively in a fast-paced and rapidly changing environment
- Ability to take the initiative and drive for results
- Texas Instruments will not sponsor job applicants for visas or work authorization for this position.
