Qorvo is looking for a Packaging Engineering Intern to help improve processes related to Advanced Packaging and Substrate Technology Development, Substrate Design Rules and Manufacturing Processes, and Assembly and Marking diagrams.
Requirements
- Mechanical/Material/Chemical/Electrical Engineering skills
- Background with packaging materials (theoretical or practical). i.e. solder, epoxy, flux, mold compound preferred
- Background with assembly process (theoretical or practical). i.e. Wire Bond, Die Attach, Flip Chip preferred
Responsibilities
- Learn about Advanced Packaging and Substrate Technology Development projects methodologies - to help and improve the process
- Learn about Substrate Design Rules and Manufacturing Processes - Foster and mentoring
- Review Assembly and Marking diagram - look for opportunities to improve
- Plan and execute Design of Experiments in support of project deployment
- Onsite hands-on learning semiconductor assembly processes -
- Other minor activities related to documentation and continuous improvement (A3s - Lean)
Other
- BS in Materials Science, Chemical, Mechanical, or Electrical Engineering
- Communication and presentation skills
- Ability to manage and drive problem resolution
- Demonstrate strong analytical thinking skills
- 3.0 GPA or higher
- This position is not eligible for visa sponsorship by the Company.
- Competitive hourly pay commensurate with experience: $31/hr - $42/hr
