Texas Institute for Electronics (TIE) aims to develop and execute a state-of-the-art 3D Heterogenous Integration manufacturing technology roadmap and provide critical pilot manufacturing capabilities to address national security needs and catalyze domestic economic growth. The Postdoctoral Fellow will contribute to this mission by conducting research in physics-informed AI/ML for digital twin functionalities in microelectronics and advanced packaging.
Requirements
- PhD earned within the last 3 years in Operations Research and Industrial Engineering or a closely related discipline, with a focus on data analytics, AI, ML, advanced process control, and digital twin technologies in semiconductor manufacturing.
- Experience with handling industrial big data problems, physics-informed AI/ML, advanced optimization and control of semiconductor manufacturing processes and systems.
- Experience in working with advanced AI/ML software packages and super-computing cluster systems, including Hadoop, Spark, Python and Matlab.
- Familiarity with co-optimization and co-control of multistage manufacturing systems is a big plus
- Familiarity with microelectronics packaging and heterogeneous integration is also a big plus.
Responsibilities
- Develop multiscale and multiphysics modeling for thermomechanical effects on high performance heat spreaders based on materials such as diamond thin films.
- Collaborate with experimental groups on characterization of thermomechanical properties of diamond thin films and other thermal interface materials.
- Develop manuscripts for publishing in archival journals based on the research results.
Other
- Must be authorized to work in the United States on a full-time basis for any employer without sponsorship.
- Communicate effectively with PI and collaborators in regular meetings.
- Other duties as assigned.
- Resume/CV
- 3 work references with their contact information; at least one reference should be from a supervisor
- Letter of interest
