Microchip Technology, Inc. is seeking a Principal Packaging Engineer to be responsible for advanced semiconductor package development within their FPGA Business Unit, aiming to meet the electrical, mechanical, and thermal requirements of high-performance flip chip packages for new FPGA devices.
Requirements
- Minimum of 10 years of professional experience, including at least 5 years focused on semiconductor IC packaging.
- Well versed with mid-range pin count packaging solutions, including but not limited to organic and ceramic flip chip BGA/LGA,WLCSP, wire bond BGA, and CSP.
- Strong understanding of materials as related to chip packaging interaction.
- Familiar with wafer BEOL (top metal, passivation, UBM, bumping etc.).
- Strong knowledge of advanced substrate manufacturing/process.
- Knowledgeable in JEDEC, AEC and IPC requirements for component and board level reliability qualification.
- Experience with Ansys Electronic Desktop
Responsibilities
- Co-design packages with Silicon, Packaging, and Systems engineering teams to ensure designed packages meet electrical, mechanical and thermal requirements of high-performance flip chip packages.
- Work with business unit’s IC design teams to select the optimum package solution on cost, performance, manufacturability, and reliability for new FPGA devices, satisfying business unit’s roadmap for new products.
- Learn and define assembly BOM, process, troubleshoot, and support packaging issues of new advanced technology.
- Create package design documentation and assembly instructions.
- Participate in package technology development and/or other business productivity projects which have broad team impact (e.g. assembly process enhancement, new technology/structure development etc.)
- Manage package qualification for commercial and automotive applications.
- Coordinate with assembly vendors on new packages from development to high volume production.
Other
- Proven project management, communication, and leadership skills.
- Willingness and ability to grow expertise in multiple disciplines, including manufacturing/quality, materials, electrical, thermal, and mechanical engineering.
- Strong technical skills in resolving customer issues related to IC package quality and reliability
- Travel up to 10% is expected.
- Bachelor’s or Master’s Degree in Electrical or Mechanical Engineering.
