Filtr uses AI to scan 1000+ jobs and finds postings that perfectly matches your resume

Marvell is looking to solve the technical challenges of next generation high performance computing (HPC), Artificial Intelligence (AI) and networking solutions by developing innovative packaging technologies and solutions.

Requirements

• Understanding of signal integrity and power integrity concepts and fundamentals
• Experience in package development, including interposer design
• Experience with EDA simulation tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity tools
• Familiarity with packaging technologies, materials, package substrate design rules and assembly rules
• Experience with simulation and analysis using tools like PowerSI, SIwave
• Working knowledge of circuit extractions and simulations
• Board and system level signal and power integrity analysis

Responsibilities

• SI/PI analysis of designs and optimization within 2D/2.5D/3D packages
• Interfacing with product design teams and clients for optimized floor-planning, package substrate design, and power delivery network design
• Perform wiring studies in order to determine optimal signal routing, power delivery verification and package size determination
• Training and mentoring within a growing team of Signal and Power Integrity engineers
• Evaluating package or PCB designs for challenging electrical requirements
• Close interaction with physical designers and IP teams to optimize electrical performance
• Executing simulation tasks for signal and power integrity sign-off

Other

• People management or technical leadership
• Ability to work with engineers in multiple locations and geographies
• Strong communication, presentation and documentation skills
• Bachelor's degree in electrical engineering or related fields and 10+ years of related professional experience
• Ability to manage programs involving cross-functional teams