Raytheon is seeking a Principal Mechanical Engineer to lead new product development within the Electronic Warfare Mechanical Design Hardware Department to design, integrate, verify, and produce digital processor and RF receiver subsystems for airborne platforms.
Requirements
- Working knowledge of electronics packaging design and manufacturing.
- Thermal and structural design and analysis.
- Electrical component design, construction and failure modes.
- Printed wiring board and circuit card assembly processes and best practices.
- Surface mount and through hole component installation processes and failure modes.
- Metal fabrication and finishing methods.
- RF isolation mechanical design.
Responsibilities
- The Principal Engineer is a key technical contributor to the programs and products supported by the department.
- Designing RF systems for challenging thermal and high vibration environments.
- Leading programs as a Responsible Engineering Authority (REA) or Integrated Product Team Lead (IPTL), and serves as a liaison to programs, ensuring program success along technical, cost and schedule parameters.
- Overseeing junior engineer’s job assignments and performance.
- Providing technical guidance and act as a mentor to his/her matrix team.
- Making technical presentations and establishing customer relationships.
- Leading by example, possessing strong interpersonal, written and verbal communication skills, and maintaining positive relationships and satisfaction with functional and program leadership.
Other
- U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.
- The ability to obtain and maintain a U.S. government issued security clearance is required.
- Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) and a minimum of 8 years of prior relevant experience.
- Strong interpersonal, written and verbal communication skills.
- Ability to work onsite in Goleta, California.
