Siemens EDA is looking to solve complex technology challenges in advanced solution adoptions for their leading customers by developing and deploying next-generation computational-patterning and mask solutions.
Requirements
- 15+ years of experience in Computational Lithography, with expertise gained from roles at EDA suppliers or within customer technology development teams.
- 10+ years of hands-on experience in OPC, Modeling, Mask Synthesis, Inverse Lithography, etc.
- In-depth knowledge of IC manufacturing processes, with direct experience working at leading IC manufacturing companies.
- Strong understanding of the foundry ecosystem and hands-on experience with yield ramp-up processes for leading-node technologies.
Responsibilities
- Collaborate with R&D to develop and deploy next-generation computational-patterning and mask solutions, including Curvilinear OPC & MBAF, MBR, ILT, MRC, MPC and Fracturing solutions for advanced customer needs.
- Be part of the Division path-finding team to develop the prototype and proof-of-concept demonstration for N+1 node.
- Work closely with leading customers to solve complex technology challenges in advanced solution adoptions.
Other
- A Master’s or Ph.D. in Computer Science, Electrical Engineering, or a related field.
- 5+ years of proven experience managing cross-functional teams (R&D, Product, and Applications) with strong leadership and hands-on management skills.
- Demonstrated ability to thrive in a matrixed global organization and fast-paced team environments.
- Proven success in engaging customers and internal stakeholders to promote and deploy new technologies, processes, and system solutions.
- A track record of delivering high-quality projects on time.
- Willingness and ability to travel domestically and internationally as needed.
- Exceptional English communication skills, both verbal and written.
