TE Connectivity is looking to solve thermal challenges in the high-speed interconnect industry by driving new products from concept to high-volume manufacturing
Requirements
- 10+ years of thermal modeling with ANSYS Icepak, Fluent, and/or similar CFD tool
- 3D CAD skills with PTC Creo (ProE) or ANSYS SpaceClaim
- Experience with and knowledge of liquid and/or immersion cooling
- Experience with mechanical structural analysis is a plus
- Experience in and knowledge of the high-speed digital industry is a plus
- Experience in core processes such as stamping, molding, plating, and assembly preferred
- Familiarity with standards related to data center cooling (e.g, ASHRAE)
Responsibilities
- Develop innovative cooling solutions for the high-speed digital interconnect industry
- Research and apply emerging technologies to new product development
- Analyze electronics cooling problems through robust modeling methods
- Address near-adjacent technical challenges such as manufacturability, tolerancing, structural integrity, life cycle, cost & market acceptance
- Help expand global Best Known Methods related to simulation
- Present data and ideas in a clear and impactful manner
- Interface with engineering teams of various disciplines, including external customers
Other
- Bachelor’s Degree in related field required; Masters or PhD preferred
- 10+ years of engineering experience, including 6+ years in the electronics cooling industry
- Self-motivated, efficient, able to work with little or no supervision, and committed to a team approach
- Strong interpersonal, organization, and project management skills
- Ability to prioritize responsibilities in a fast-paced work environment
