Raycon is transitioning from a high-growth startup to a globally recognized brand and needs to upgrade internal chipsets, improve audio architectures, test and resolve hardware defects, and evaluate next-gen features to build the next generation of high-performance audio wearables.
Requirements
- Experience evaluating and integrating Bluetooth chipsets (e.g., Qualcomm, Airoha, BES), audio codecs, and power management ICs
- Proven ability to identify, isolate, and fix hardware defects
- Experience working with Asian ODMs and managing EVT/DVT/PVT processes
Responsibilities
- Drive hardware innovation by identifying and integrating upgraded chipsets, Bluetooth SoCs, and DSP platforms across our product lines
- Lead defect root cause analysis and validation, using tools like oscilloscopes, analyzers, and QA platforms to test real-world performance
- Scope and prototype future product advancements in wireless audio, power efficiency, noise cancellation, and connectivity
- Define and maintain technical product requirements, working closely with overseas vendors, manufacturing partners, and internal cross-functional teams
- Collaborate with Product, Sales, Digital, and Analytics to align hardware capabilities with go-to-market plans and competitive positioning
- Monitor technical KPIs and ensure milestones are achieved on time while escalating blockers and surfacing critical insights
- Build and maintain documentation for component testing, pilot runs, and quality assurance benchmarks
Other
- Hybrid: 1 day remote, 4 days in office per week.
- 4 - 6 years of hands-on experience in consumer electronics or embedded systems development (wireless audio strongly preferred)
- A strong sense of ownership and the drive to work through ambiguity and fast-paced hardware development cycles
- Passion for audio products and interest in building for real-world consumer use cases
- Collaborate cross-functionally with Product, Marketing and Quality teams while driving critical hardware initiatives from early concept through launch phase