Raytheon Vision Systems (RVS) is seeking a Semiconductor Product Engineer to lead advanced Focal Plane Arrays (FPA) and 3DHI technology development programs and IRaD efforts at their Lompoc 200mm Silicon wafer fabrication facility. The role involves managing the design, manufacture, test, and delivery of visible FPA, 3D integration, and/or MEMS programs, ensuring engineering requirements, risks, schedules, and budgets are met.
Requirements
- Knowledge of readout Integrated Circuit (ROIC) Design & Operation.
- Knowledge of Design Verification Techniques, SiPIN detector fabrication and operation and Manufacturing Planning and Non-conforming Material Control
- Proficient in Microsoft Project application, Microsoft Word, Excel & PowerPoint applications and Earned Value Management Systems.
- Knowledge of Performance metrics specifications (Analysis, Flowdown, Writing) and Process Yields and Analysis.
Responsibilities
- Supporting semiconductor wafer processing in a cleanroom environment.
- Understand and analyze data related to semiconductor device performance.
- Work with Design of Experiments (DoE) and Statistical Process Control (SPC)
- Work with failure analysis techniques such as 8D and Root Cause & Corrective Action reporting.
- Handling Bids and Proposals.
- Team Leadership and project planning.
- Prepare Technical writings.
Other
- The ability to obtain and maintain a U.S. government issued security clearance is required. U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
- DoD Clearance: Secret
- Typically requires a degree in Science, Technology, Engineering, Mathematics, or a STEM related degree and a minimum of 5 years related experience or an advanced degree with 3 years of related experience.
- Product and/or project/program Engineer experience.
- Strong communication skills
- PMP Certification
