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onsemi is seeking a Senior Packaging Electrical Simulation Engineer to support new package and system integration development, new product design, assembly and process, quality and reliability, and customers worldwide.

Requirements

• Experience and skills in electrical modeling and simulation in packaging and system level
• Knowledge and experience of CAD concepts and Solidworks
• Familiar with semiconductor packaging and system integration
• Familiar with material electrical properties
• Ability to perform model correlation to empirical measurement
• Familiar with the Unix/Linux operating system
• Familiar with FEA software ANSYS HFSS, SIWave, Q3D, Maxwell and ANSYS electronics desktop

Responsibilities

• Do packaging and system level integration electrical simulation
• Do electrical-thermal-mechanical interaction for ISG chiplet, ASG, 3D integration and next generation break-through power module
• Parasitic RLC for low frequency
• High frequency simulation including MIPI/S-parameters
• Do analysis and correlation of modeling results to measured data
• Develop and maintain the state of art system integration, electrical, electrical-thermo modeling methodology to improve the modeling work efficiency and accuracy
• Setup and maintain the HW/SW environment for electrical-thermo-mechanical modeling

Other

• PhD degree (or Master degree with 3 year experiences) in Electrical Engineering, electrical simulation, Physics with e-simulation.
• Strong knowledge of problem analysis and diagnosis technique
• Familiar with package test and analysis, quality assurance, and reliability methods
• Strong English communication capability
• Strong learning capability