Northrop Grumman Mission Systems is seeking an accomplished Senior Principal Microelectronics Engineer to lead advanced packaging and microelectronics assembly initiatives for high-reliability, mission-critical systems.
Requirements
- Hands-on and leadership experience with eutectic die attach, thermosonic wire bonding (Au/Al), hermetic encapsulation/seam sealing, and laser dicing along with the demonstrated ability to analyze packaging yield data, drive process improvements, and lead corrective actions.
- Strong understanding of high-reliability manufacturing standards (MIL-STD-883, MIL-PRF-38535, NASA/ESA packaging guidelines).
- Experience working in a production or manufacturing environment and generating specifications for procurement of new equipment.
- Develop manufacturing processes, work instructions and production layouts required to fabricate the product.
- Identify process improvements, capture feedback from Operations and incorporate changes into the manufacturing process.
- Respond to design and specification changes by capturing details into the manufacturing process.
- Analyze yield and scrap rate data to aid in improving processes.
Responsibilities
- Own end-to-end packaging flows, including wafer prep, laser dicing, die attach (eutectic and epoxy), pick-and-place, wire bonding, hermetic encapsulation, seam sealing, and tape-and-reel.
- Ensure all packaging processes meet MIL-STD, NASA, JEDEC, and customer specifications for high-reliability applications, including Class K space hardware.
- Provide a system-level perspective of how packaging processes interact and impact device performance, yield, and long-term reliability. Drive design-for-packaging into product development lifecycles.
- Serve as a subject matter expert (SME) in packaging for internal teams, customer reviews, and external audits. Provide technical guidance in supplier evaluations, tool procurements, and process qualifications.
- Lead root cause investigations on complex yield and reliability challenges. Direct corrective and preventive actions across the packaging value stream.
- Identify and champion new packaging technologies, equipment, and methodologies to improve manufacturability, throughput, and reliability.
- Author and review technical documentation, including process travelers, work instructions, and qualification reports to ensure compliance with customer and regulatory standards.
Other
- Bachelor’s degree in Mechanical Engineering, Materials Science, Electrical Engineering, or related field and 8+ years of experience in microelectronics packaging, or 6+ years with a Master’s degree, or 4+ years with a PhD.
- Proven ability to lead cross-functional teams, interface with customers, and act as a technical authority.
- Active or ability to obtain a U.S. DoD Secret clearance.
- Master's or PhD in Mechanical Engineering, Materials Science, or related discipline.
- 12+ years of experience in semiconductor/microelectronics packaging for space, defense, or medical devices.
