Intel Advanced Technologies Group (IATG) is looking to advance datacenter connectivity and strengthen Intel's competitive edge in Scalable AI system design by developing critical high-speed optical circuits and deploying co-packaged silicon photonics optical I/O chiplets.
Requirements
- Deep expertise in the design and optimization of active and passive optoelectronic devices, including modulators, photodetectors, lasers, and semiconductor optical amplifiers (SOAs).
- Strong proficiency with photonic integrated circuit (PIC) design CAD tools.
- Extensive tapeout experience with photonics foundries.
- Hands-on experience in testing and characterization of integrated optoelectronic components.
- Solid understanding of high-speed analog circuitry, including transimpedance amplifiers (TIAs) and modulator drivers.
- Knowledgeable in PIC and module packaging for optical communication systems.
- Proven experience driving device maturity in foundries and transitioning photonic devices (silicon and III-V) from R_D through New Product Introduction (NPI) to high-volume production for optical engines and/or laser modules.
Responsibilities
- Define architectures and designs that meet specifications and performance targets for next-generation optical interconnects.
- Develop core integrated circuit components.
- Collaborate with cross-functional teams to lead overall project development.
- Plan design activities considering performance, schedule, and quality constraints.
- Mentor junior designers and layout engineers.
- Advise on the development of test plans for post-silicon characterization.
- Thoroughly document all design work with review materials and detailed design descriptions.
Other
- Ph.D. in Electrical and Computer Engineering, Optics and Optical Engineering, or Physics or related field.
- At least 10 years of industry experience in the design and optimization of silicon photonics (SiPh) and/or III-V photonic devices, as well as photonic integrated circuits.
- Minimum of 5 years of experience mentoring individual contributors and leading cross-functional teams across design, testing, and packaging disciplines.
- Excellent oral and written communication skills.
- On-site presence required.
