At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat.
Requirements
- Knowledge of readout Integrated Circuit (ROIC) Design & Operation.
- Knowledge of Design Verification Techniques, SiPIN detector fabrication and operation and Manufacturing Planning and Non-conforming Material Control
- Proficient in Microsoft Project application, Microsoft Word, Excel & PowerPoint applications and Earned Value Management Systems.
- Knowledge of Performance metrics specifications (Analysis, Flowdown, Writing) and Process Yields and Analysis.
- PMP Certification
- Semiconductor wafer processing knowledge
- Experience with 3D Integration and Imaging Sensors
Responsibilities
- Supporting semiconductor wafer processing in a cleanroom environment.
- Understand and analyze data related to semiconductor device performance.
- Work with Design of Experiments (DoE) and Statistical Process Control (SPC)
- Work with failure analysis techniques such as 8D and Root Cause & Corrective Action reporting.
- Handling Bids and Proposals.
- Team Leadership and project planning.
- Prepare Technical writings.
Other
- Typically requires a degree in Science, Technology, Engineering, Mathematics, or a STEM related degree and a minimum of 8 years related experience or an advanced degree with 5 years of related experience.
- U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance
- The ability to obtain and maintain a U.S. government issued security clearance is required.
- Strong communication skills
- Onsite: Employees who are working in Onsite roles will work primarily onsite.
