Marvell is looking to develop next-generation test and manufacturing hardware platforms that support high-power, high-complexity semiconductor devices, requiring scalable, reliable, and cost-effective solutions for wafer, package, and system-level test.
Requirements
- Proven experience in thermal and mechanical design for semiconductor test or high-performance electronics.
- Hands-on experience with automation systems, robotics, and machine vision integration — including motion control, part handling, and connector actuation.
- Prior experience working with microwave or optical test environments, including connector mating, signal integrity, and alignment challenges.
- Proficiency with simulation and design tools such as Ansys, SolidWorks, AutoCAD, and thermal modeling platforms.
- Expertise with system-level test, ATE, and handler platforms, including thermal control, interface materials and heat spreader design.
- Strong understanding of system-level integration challenges across electrical, optical, and mechanical domains.
Responsibilities
- Lead the design, simulation, and validation of thermal and mechanical systems for advanced test infrastructure, including wafer probe, final test, and system level test.
- Architect and implement automation solutions for test equipment, robotic part handling, and machine vision systems, with a focus on precision alignment for microwave and optical interfaces.
- Develop control systems for automated insertion/extraction of microwave and optical connectors, including blind-mate and high-force applications.
- Drive innovation in thermal interface materials, cooling strategies, and mechanical fixturing to support high-power dissipation and large form factors.
- Own BOM creation, vendor engagement, and prototype validation for custom assemblies and tooling.
- Support test vehicle development and infrastructure readiness for NPI and high-volume manufacturing.
- Analyze system performance, identify bottlenecks, and iterate on design for improved reliability, repeatability, and manufacturability.
Other
- Bachelor’s degree in Mechanical Engineering, Mechatronics, Thermal Sciences, or related fields with 15+ years of relevant experience, or Master’s/PhD in Mechanical Engineering, Mechatronics, Thermal Sciences, or related fields with 10-12 years of relevant experience.
- Collaborate with photonics, microwave, and product engineering teams to ensure cohesive hardware integration and performance.
- Excellent communication and cross-functional collaboration skills.
- Self-motivated, detail-oriented, and capable of leading complex projects from concept to deployment.
- This position may require access to technology and/or software subject to U.S. export control laws and regulations, including the Export Administration Regulations (EAR). As such, applicants must be eligible to access export-controlled information as defined under applicable law.
