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Summer 2026 - AI Hardware Research Intern: 3D Generative AI Accelerator Design (7269)

TSMC

$42 - $48
Dec 17, 2025
San Jose, CA, US
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Design an edge accelerator for GenAI, based on https://dl.acm.org/doi/full/10.1145/3768168

Requirements

  • RTL design
  • Embedded DRAM options
  • 3D memory array evaluations
  • Generative AI workloads
  • Accelerator latency and energy evaluations
  • Embedded NVM options and evaluations

Responsibilities

  • Design an edge accelerator for GenAI, based on https://dl.acm.org/doi/full/10.1145/3768168
  • Evaluate PPA by RTL at N7 for all necessary building blocks
  • Evaluate and benchmark different memory options, including various eDRAM and eNVM
  • Evaluate various 3D array design options by considering the integration scheme (bonding, monolithic, hybrid) and granularity of 3D connections
  • Analyze the viability of the low-power memory access schemes at extreme bandwidth proposed in the reference and offer solutions tailored for specific memory devices and arrays
  • Quantify the differences between the new design and the analytical estimation in the reference
  • Include workload-level energy and latency benchmarks for the considered technology options

Other

  • Ph.D. Student in Electrical Engineering or Computer Science
  • Summer 2026
  • The Company supports a thriving ecosystem of global customers and partners with the industry’s leading process technologies and a portfolio of design enablement solutions to unleash innovation for the global semiconductor industry.
  • With global operations spanning Asia, Europe, and North America, TSMC serves as a committed corporate citizen around the world.
  • In North America, TSMC has a strong sales and service organization that works with customers by helping them achieve silicon success with cutting-edge technologies and manufacturing excellence.